ZSSC3123AI1D
IDT, Integrated Device Technology Inc
Deutsch
Artikelnummer: | ZSSC3123AI1D |
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Hersteller / Marke: | IDT (Renesas Electronics Corporation) |
Teil der Beschreibung.: | DICE (WAFER SAWN) - WAFFLE PACK |
Datenblätte: | None |
RoHs Status: | Lead free / RoHs compliant |
ECAD -Modell: | |
Zahlungsmittel: | PayPal / Credit Card / T/T |
Versandweg: | DHL / Fedex / TNT / UPS / EMS |
Aktie: |
Ship From: Hong Kong
Anzahl | Einzelpreis |
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100+ | $5.6981 |
Online -RFQ -Einreichungen: Schnelle Antworten, bessere Preise!
Produkteigenschaften | Eigenschaften |
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Serie | * |
Paket | Tray |
Produkteigenschaften | Eigenschaften |
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Grundproduktnummer | ZSSC3123 |
DICE (WAFER SAWN) - FRAME
IC INTFACE SPECIALIZED SGNL COND
DICE (WAFER SAWN) - WAFFLE PACK
OPN - WAFER (UNSAWN) - BOX
DICE (WAFER SAWN) - FRAME
TSSOP / 14 / 4,4MM G1 - TUBE
OPN - WAFER (UNSAWN) - BOX
DICE (WAFER SAWN) - FRAME
TSSOP / 14 / 4,4MM G1 - TAPE&REE
TSSOP / 14 / 4,4MM G1 - TUBE
WAFER (UNSAWN) - BOX
IC INTFACE SPECIALIZED SGNL COND
IC INTFACE SPECIALIZED SGNL COND
WAFER (UNSAWN) - WAFER BOX
WAFER (UNSAWN) - BOX
TSSOP / 14 / 4,4MM G1 - TAPE&REE
DICE (WAFER SAWN) - FRAME
ZSSC3123 MASS CALIBRATION SYSTEM
WAFER (UNSAWN) - BOX
IC INTFACE SPECIALIZED SGNL COND
2024/06/6
2024/04/18
2024/04/13
2023/12/20
![]() ZSSC3123AI1DIDT, Integrated Device Technology Inc |
Anzahl*
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Zielpreis (USD)
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